DSMI group
Originally active in IC sockets, PCB and coaxial connectors, the society DSMI electronics SA has, along the years, diversified its activities. In 2004, DSMI acquired Precicontact and all his manufacturing equipment, processes and stocks. Two years later, DSMI opened an anglage department for watchmaking, a key industrial sector in Switzerland. Meanwhile, DSMI took part in developping a new patented product invented by two young swiss engineers: The SnowPulse Avalanche Air Bags.
Our know-how at your service
We can help you with following:
Subcontracting
You are at full production capacity! Looking for a supplier with ability to do the machining, the assembly and the purchasing of components.
Prototyping
Starting new project! But you don't have the ressources and time to produce samples or prototypes.
Industrialization and mass-production
Looking for a partner able to invest and to find the right methodology to launch the mass-production of your items.
Dicontinuance of activity
You want to defer a product, or a small manufacturing company.
Product range
You are in electronics, clock-making, medical, micromechanics or microtechnics.
BGA
Ball Grid Array Sockets
Description
Ball Grid Array Sockets (BGA)
Precicontact innovations
- Ultra low floating pin.
- Progressive Insertion.
- Low insertion force.
- Optional : Wave soldering for socket.
- Optional : No floating pin.
- Optional : Kapton for BGA adapter
ROWS | A ( MM.) | A ( Inches ) | ROWS | A ( MM.) | A ( Inches ) | ||||
7 | * | 7 | 11.43 | 4.50 | 21 | * | 21 | 29.21 | 11.50 |
8 | * | 8 | 12.70 | 5.00 | 22 | * | 22 | 30.48 | 12.00 |
9 | * | 9 | 13.97 | 5.50 | 23 | * | 23 | 31.75 | 12.50 |
10 | * | 10 | 15.24 | 6.00 | 24 | * | 24 | 33.02 | 13.00 |
11 | * | 11 | 16.51 | 6.50 | 25 | * | 25 | 34.29 | 13.50 |
12 | * | 12 | 17.78 | 7.00 | 26 | * | 26 | 35.56 | 14.00 |
13 | * | 13 | 19.05 | 7.50 | 27 | * | 27 | 36.83 | 14.50 |
14 | * | 14 | 20.32 | 8.00 | 28 | * | 28 | 38.10 | 15.00 |
15 | * | 15 | 21.59 | 8.50 | 29 | * | 29 | 39.37 | 15.50 |
16 | * | 16 | 22.86 | 9.00 | 30 | * | 30 | 40.64 | 16.00 |
17 | * | 17 | 24.13 | 9.50 | 31 | * | 31 | 41.91 | 16.50 |
18 | * | 18 | 25.40 | 10.00 | 32 | * | 32 | 43.18 | 17.00 |
19 | * | 19 | 26.67 | 10.50 | 33 | * | 33 | 44.45 | 17.50 |
20 | * | 20 | 27.94 | 11.00 | 34 | * | 34 | 45.72 | 18.00 |
 | Floating pin: 1.065 mm No floating pin: 0.720 mm |
| Part | Reference | Example | Details |
| BGA BALL SOCKET | BGA-XX-Y-4-S-2 | BGA-2020-272-4S-2 | Floating pins |
| BGA BALL SOCKET | BGAM-XX-Y-4-S-2 | BGAM-2020-272-4S-2 | No floatin pins |
| BGA PIN SOCKET | BGA-XX-Y-4-F-2 | BGA-2020-272-4F-2 | Socket for wave soldering |
| BGA ADAPTER | BGA-XX-Y-1-A | BGA-2020-272-1-A | Floating pins |
| BGA ADAPTER | BGA-XX-Y-1-K | BGA-2020-272-1-K | No floating pins |
Rows: XX Number of pins: Y
Standard Requirements :
- Insulator : Glass-filled Epoxy, FR5, Rated to UL94V-0.
- Pin male : Gold 5 µ" (0.13 µm).
- Pin female : Tin 150 µ (3.80 µm).
- Inner contact : Gold 10 µ" (0.25 µm).
Performance specifications :
- Insertion force - 35g per contact and progressive insertion.
- Withdrawal force - 15g per contact.
- Soldering : solder cream,stencil printer or dispensing, and I.R. furnace.
- Maximum Operating Current - 1 Ampere per contact.
- Minimum Durability - 50 cycles.
- Operating Temperature - 65°C to 125°C.
Others :
- Grid : .050 " ( 1.27 mm) or (1.5 mm).
- For specific socket specifications consult the factory.
- All BGA footprints available.
DSMI electronics SA